RUICHIPS SEMICONDUCTOR
Assembly and Testing Services

Ruichips offers advanced assembly and testing technology, including high-precision equipment and automated production lines. We provide services for various packaging forms like QFN, DFN, SOP, SSOP, SOT, TSSOP, and TO. Our comprehensive quality management system ensures product quality through strict inspections at every stage. Additionally, our professional customer service team handles communication, inquiries, and after-sales issues.

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Ruichips SEMICONDUCTOR


Assembly and Testing

Services

Packaging Types

Maximum Chip Size

POD Diagram

SOT23-6

1.29*1.83mm

SOT23-5

1.29*1.83mm

SOT23-3

1.29*1.83mm

SOP16L

2.39*3.81mm

SOP8

2.49*4.06mm

DFN5X6-8L(Dual Die)

4.78*4.57mm

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Ruichips SEMICONDUCTOR


Assembly and Testing

Equipment

Ruichips has industry-leading assembly and testing technology, including but not limited to advanced packaging processes, high-precision testing equipment, and automated production lines. We provide assembly and testing services for customers, with packaging forms such as QFN, DFN, SOP, SSOP, SOT, TSSOP, TO, etc., we have established a comprehensive quality management system, conducting strict inspections at every stage of packaging and testing process to ensure product quality. Additionally, we have a professional customer service team responsible for communicating with customers, answering questions, and handling after-sales issues.

Assembly Equipment

Assembly Equipment


Assembly Equipment

Assembly Equipment


Assembly Equipment

Assembly Equipment


SAT

SAT